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Item #:
155023960
Electronic Packaging Guidebook for Managing Silicon Chip Reliability, Book 5, (Paperback)
Item #:
155023960
TMT 292
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What Stands Out
Comprehensive Insights
Offers an in-depth exploration of silicon chip reliability issues, providing engineers and professionals with essential knowledge for effective electronic packaging strategies.
Expert Contributions
Curated contributions from leading industry experts ensure authoritative content, delivering advanced methodologies and best practices for managing silicon chip reliability.
Practical Applications
Includes real-world case studies and practical applications that help readers effectively implement theories and concepts in their own projects, enhancing overall chip performance and longevity.
Product Details
| Manual & guide type | Instruction Manual |
| Book format | Paperback |
| Edition | 1 |
| Pages | 224 |
| Language | English |
| Brand | Michael Pecht |
| Pub date | 20191007 |
| Author | Michael Pecht |
| Subgenre | Electrical |
| Genre | Computing & Internet |
| Bisac subject heading | Technology & Engineering |
| Series title | Electronic Packaging |
| Number in series | 5 |
| Dimensions | 6.14 x 0.48 x 9.21 in (15.6 x 1.2 x 23.4 cm) |
| Age group | Adult |
| Retail packaging | Single Piece |
| Original languages | English |
Who Should Buy?
-
Engineering Students
Ideal for students studying electronics and materials, providing foundational knowledge in silicon chip packaging and reliability.
-
Industry Professionals
Beneficial for engineers and technologists working in semiconductor manufacturing needing detailed guidelines for reliability management.
-
Research Academics
Useful for researchers focusing on semiconductor reliability, offering insights and methodologies for evaluating packaging techniques.
-
General Readers
Not suitable for those without technical background as content is specialized and may be too complex to understand.
Product Description
Electronic Packaging Guidebook for Managing Silicon Chip Reliability, Book 5, (Paperback)
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